X-ray Automatic Inspection System XS Series, manufactured by Nordson
A high-resolution (<1μm) X-ray automatic inspection system designed for micro samples, such as wire bonding and micro bump bonding.
The XS series is a compact, high-resolution automatic X-ray inspection system designed for high-performance and high-speed inspection of semiconductor samples, wire bonding, single/multi-panel PCB assemblies, and samples on trays. It is capable of inspecting applications ranging from component-level inspections to medium-sized SMT boards.
- Company：日精 本社
- Price：Other
